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LFPE0102B00

PE01-M4×10.5-9.0ET

PE01 PCB Connectors

PE01 Series Press-fit

Suitable for high current line to board and board to board connections, fuse connections
Easy installation, high reliability, strong stability, and low solderless resistance
Very suitable for continuous current and peak current
Suitable for harsh environments
Can provide customized UNC threads 

         
PRESS-FIT installation process
Compliant with IEC352-5
Pressing force: minimum 40N for a single needle
Pullout force: Single needle minimum 30N (after 24 hours of installation)
Installation speed: 100-250 mm/min
PCB board thickness: 1.6-3.2mm          

REQUEST SAMPLES
M Thread size M4x0.7
T1 Thread Length 6.0 mm
H Total Height 10.5 mm
H1 Body Length 7.0 mm
L Section Size 9.0 mm
Pins 8
Current rating 160 A
Tigntening Torque 1.2 Nm
Materials Brass
Surface Treatment Tin plated
Installation Equipment/Method Press-fit
Type  PE01pys

What is the advantage of press fit element ?

Advantages of using press-fit components in PCB assembly include:

Mechanical Strength: Press-fit connections provide a strong mechanical bond, which is especially beneficial in applications subject to vibration or mechanical stress. This strength enhances the durability and reliability of the connection.

NO THERMAL STRESS: Because crimping does not involve soldering, it eliminates thermal stress that can affect sensitive components and the PCB itself. This is especially important for heat-sensitive components.

Reworkability: Crimp components can often be removed and replaced without damaging the PCB, making repairs and modifications easier. This has significant advantages during prototyping and in situations where design changes may be required.

Reduced risk of contamination: No need for welding means less risk of flux contamination, which can be an issue in the welding process. This results in a cleaner assembly and may improve performance.

CONSISTENT QUALITY: Crimp technology provides consistent and repeatable connections, which can improve overall product quality and reliability.

Reduced Thermal Cycling Issues: Press-fit connections are less susceptible to issues related to thermal cycling that can lead to solder joint fatigue over time.

Compatibility with high-density designs: Press-fit technology has advantages in high-density PCB designs where space is limited because it allows for a more compact layout without the need for pads.

Cost Effectiveness in High Volume Production: Although the initial setup of press fit may be higher, in high volume production the overall cost can be competitive due to shorter assembly times and lower rework rates.