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          LFPE2502

          PE25-M4×7.8-OD7.0DT

          PE25 PCB Connectors

          PE25 Series Surface Mounted Technology

          Suitable for PCB board to board and board to board connections
          Carrier packaging, suitable for SMT automated installation, saving time and labor costs
          Has good heat dissipation
          Combining the technological advantages of through-holes (high mechanical stability) with time-saving installation and efficient reflow soldering
          Can provide customized UNC threads
           
          SMT reflow soldering installation
          REQUEST SAMPLES
          TECHNICAL PARAMETER
          FAQ
          M Thread size M4x0.7
          T1 Thread Length 4.0 mm
          H Total Height 7.8 mm
          H1 Body Length 7.0 mm
          OD Outside Diameter 7.0 mm
          Current rating 50A
          Tigntening Torque 1.2 Nm
          Materials Brass
          Surface Treatment Tin plated
          Installation Equipment/Method SMT
          smd-smt-terminals-pe25 DATA

          What is surface mount technology in PCB?

          Surface mount technology (SMT) is a method used in printed circuit board (PCB) manufacturing where electronic components are mounted directly on the surface of the PCB, rather than inserted into holes as in traditional through-hole technology. Due to the various advantages this technology offers, it has become the standard for modern electronics.

          Main features of SMT:
          Component Design: SMT components are usually smaller and lighter than through-hole components. They usually have shorter leads and are designed to be soldered directly to the PCB surface.

          Manufacturing process:
          Solder Paste Application: Use a stencil to apply solder paste to the pads on the PCB where the components will be placed.
          Component Placement: Automatic pick and place machines place SMT components onto solder paste covered pads.
          Reflow Soldering: The assembled PCB is then placed in a reflow oven and heated, the solder paste melts and forms a strong connection between the component and the PCB.

          Advantages:
          Higher component density: SMT allows more components to be placed on a PCB, resulting in smaller, more compact designs.
          Improved Performance: Shorter lead lengths reduce inductance and resistance, which can enhance performance in high-frequency circuits.
          Automated Production: Using machines for placement and welding increases production speed and consistency, reducing labor costs and the potential for human error.
          Cost Effective: While the initial setup for SMT may be higher, the overall cost per unit may be lower due to reduced material usage and faster production time.

          Disadvantages:
          Repair and Rework: SMT components are more challenging to replace or repair than easily accessible through-hole components.
          Thermal Management: Some SMT components may have different thermal characteristics and require careful consideration of thermal design.

          Application: SMT is widely used in various electronic devices, including consumer electronics, telecommunications, automotive systems and medical devices.

          Overall, surface mount technology has revolutionized PCB design and manufacturing, making it possible to produce smaller, more efficient, and more complex electronic devices.